Acta Chimica Sinica ›› 2004, Vol. 62 ›› Issue (20): 2010-2014. Previous Articles     Next Articles

纳米二氧化硅对镍电沉积影响及在复合镀层中的化学键合状态

涂伟毅, 徐滨士, 董世运, 蒋斌, 杜令忠, 胡振峰   

  1. 装甲兵工程学院, 装备再制造技术国防科技重点实验室, 北京, 100072
  • 收稿日期:2003-08-31 修回日期:2004-06-10 出版日期:2004-10-28 发布日期:2014-02-17
  • 通讯作者: 涂伟毅,E-mail:weiyitu@sohu.com;Tel:010-66718541 E-mail:weiyitu@sohu.com
  • 基金资助:
    国家973项目子项目(No.G1999065009)、国家自然科学基金重点项目(No.50235030)及中英政府科技合作基金(No.2002M3)资助项目.

Effect of n-SiO2 on Electrodeposition of Nickel and Chemical Bonding Interaction between Nanoparticles and Matrix Metal in the Composite Coating

TU Wei-Yi, XU Bin-Shi, DONG Shi-Yun, JIANG Bin, DU Ling-Zhong, HU Zhen-Feng   

  1. State Key Laboratory of Remanufacture Technology, Armored Force Engineering Institute, Beijing 100072
  • Received:2003-08-31 Revised:2004-06-10 Online:2004-10-28 Published:2014-02-17

The electrochemical response from n-SiO2/Ni composite brush plating system was researched by means of cyclicvoltammetry and potential step. The interaction between nanoparticles and matrix metal nickel was investigated by X-ray photoelectron spectrometry. The results show that nanoparticles lead to increasing of the current efficiency, ratio of nucleation and crystal growth rate as well as decreasing of overpotential. Nanoparticles can catalyze the nickel electrodeposition and reduce the size of metal crystal. As the nickel atoms reduced on cathode are diffusing on the metal growth surface, the unsaturated bond of oxygen atoms on nanoparticle surface can capture some of the absorbed nickel atoms and form nickel-oxygen chemical bond. It is proved that the chemical bonding interaction exists on the interface between nanoparticle surface and matrix metal nickel.

Key words: nanoparticle, composite electrodeposition, chemical bonding, co-deposition mechanism