Acta Chimica Sinica ›› 2004, Vol. 62 ›› Issue (1): 34-36. Previous Articles     Next Articles


何丽君, 王春明   

  1. 兰州大学化学化工学院, 兰州, 730000
  • 投稿日期:2003-05-19 修回日期:2003-09-10 发布日期:2014-01-26
  • 通讯作者: 王春明
  • 基金资助:

Preparation and Characterization of the Extra-thin Copper Film Wrapped Diamond Nanoparticles

HE Li-Jun, WANG Chun-Ming   

  1. College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000
  • Received:2003-05-19 Revised:2003-09-10 Published:2014-01-26

The extra-thin copper film wrapped diamond nanoparticles were prepared by using electroless plating method under the condition of tin chloride sensitization and palladium chloride activation. The prepared particles were analyzed by using X-ray diffraction (XRD) and Fourier transform infrared spectrometry (FTIR). The ethanol solvent of the nanoparticles kept stable without sedimentation within half year.

Key words: nanodiamond, electroless plating, extra-thin copper film