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Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field
Diao Zhijun, Zhao Yuemin, Chen Bo, Duan Chenlong
Acta Chimica Sinica . 2012, (
19
): 2037 -2044 . DOI: 10.6023/A12070451
