Acta Chimica Sinica ›› 2009, Vol. 67 ›› Issue (24): 2798-2802. Previous Articles     Next Articles

Special Topic

超级化学镀铜填充微道沟的研究

杨志峰1,高彦磊1,李娜1,王旭1,殷列1,王增林 2   

  1. 1. 陕西师范大学
    2. Shannxi Normal University
  • 投稿日期:2009-05-13 修回日期:2009-08-05 发布日期:2010-02-04
  • 通讯作者: 杨志峰 E-mail:1yangzhifeng@163.com

Bottom-up Filling for Submicro-Trenches by Electroless Copper Plating

Zhifeng Yangyanlei gaoNa Li2,Xu WangLie Yin 2   

  • Received:2009-05-13 Revised:2009-08-05 Published:2010-02-04
  • Contact: Zhifeng Yang E-mail:1yangzhifeng@163.com

Bottom-up filling of electroless copper can be applied not only to semiconductor ultra-
large-scale integration for copper interconnect lines, but also to three-dimensional package. The relationship
of deposition rates of an electroless copper bath with the concentration and molecular weight (Wm)
of polyethylene glycol (PEG) was investigated. The deposition rates decreased with the increases of PEG
concentration and Wm. The result of liner sweep voltammetry measurement showed that PEG inhibited the
electroless copper deposition and the inhibiting effect increased with an increase of PEG (Wm). Bottom-up
filling of trenches was achieved by addition of PEG-6000 in its concentration gradient from the top to the
bottom. The effects of PEG Wm and depth-to-width ratio of the trenches (aspect ratio) on the bottom-up filling
of electroless copper were also studied.

Key words: polyethylene glycol molecular weight, linear sweep voltammetry, bottom-up filling by electrolesscopper, micro-trench filling