The electroless deposition of copper on the monolayer film of diazoresin (DR), which was fabricated on the silicon or glass surface, was performed via absorbing SnCl₂ and Pd on the DR film. The copper film was characterized with SEM and XRD showing that the electroless deposition of copper on the substrate is successful. Through the selective electroless deposition the Cu film pattern was obtained.

Key words: diazoresin, electroless deposition, Cu film, Cu film pattern