Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing

doi:10.6023/A21080414

Acta Chimica Sinica ›› 2022, Vol. 80 ›› Issue (2): 214-228.DOI: 10.6023/A21080414 Previous Articles Next Articles

Review

溶液法制备柔性压阻式传感器的研究进展

王雨柔, 王国琪, 李想, 尹君^*(), 朱剑^*()

南开大学材料科学与工程学院天津 300350

投稿日期:2021-08-31 发布日期:2021-12-28
通讯作者: 尹君, 朱剑

作者简介:

王雨柔, 本科毕业于中国海洋大学材料科学与工程学院, 现为南开大学材料科学与工程学院硕士研究生. 导师朱剑教授, 主要研究方向为低维纳米材料的可控制备及其在柔性纳米电子器件中的应用.

尹君, 南开大学材料科学与工程学院讲师. 2019年于清华大学物理系获得博士学位, 后在南开大学任教, 研究方向包括二维电子材料和二维半导体, 以及基于二维材料的光电器件或光电探测器的机理研究.

朱剑, 南开大学材料科学与工程学院教授. 2013年于美国密歇根大学安娜堡分校的化学工程专业获得博士学位, 之后在西北大学材料科学与工程系进行博士后研究. 2017年入选国家级青年人才项目, 并受聘于南开大学材料科学与工程学院. 主要研究方向为纳米材料的合成和组装, 并探索其在高性能复合材料、信息器件及能源器件方面的应用.

基金资助:
国家自然科学基金(51873088); 国家自然科学基金(12004195); 天津市自然科学基金(18JCZDJC38400); 天津市自然科学基金(20JCQNJC01820); 中国高等教育“111”项目(B18030); 南开大学中央高校基本科研业务费专项资金(63201061); 南开大学中央高校基本科研业务费专项资金(63211044)

Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing

Yurou Wang, Guoqi Wang, Xiang Li, Jun Yin(), Jian Zhu()

School of Materials Science and Engineering, Nankai University, Tianjin 300350, China

Received:2021-08-31 Published:2021-12-28
Contact: Jun Yin, Jian Zhu
Supported by:
National Natural Science Foundation of China(51873088); National Natural Science Foundation of China(12004195); Natural Science Foundation of Tianjin, China(18JCZDJC38400); Natural Science Foundation of Tianjin, China(20JCQNJC01820); “111” Project of China’s Higher Education(B18030); Fundamental Research Funds for the Central Universities from Nankai University(63201061); Fundamental Research Funds for the Central Universities from Nankai University(63211044)

Flexible piezoresistive sensors have received great attention due to their simple structure, easy preparation, and wide range of detection, and played an indispensable role in the field of wearable electronics. Solution-based processing has emerged as one of the promising techniques for sensors with advantages of simple operation, mild reaction conditions, wide-material choices, and large-scale fabrication. Furthermore, the mechanical and electrical performances of these sensors have been continuously optimized by a range of approaches. In addition, it allows the patterning of large-area sensor arrays, which expand their practical applications. In this review, an overview of the working mechanism and performance metrics of piezoresistive sensors is provided with detailed explanations of their influences on real applications. Then, the materials used for sensors preparation are introduced. Subsequently, the recent research progress of flexible piezoresistive sensors fabricated by solution-based processing is summarized. Several important solution-based methods are compared to illustrate their advantages and challenges. This review is concluded with a prospect of future development in the field of flexible solution-processed sensors.

Key words: wearable electronics, piezoresistive sensor, flexible sensor, performance metrics, solution processing

Cite this article

Yurou Wang, Guoqi Wang, Xiang Li, Jun Yin, Jian Zhu. Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing[J]. Acta Chimica Sinica, 2022, 80(2): 214-228.

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Fig. & Tab. 19

Figure 1. Crack-based sensor inspired by the spider joints[17]. (a) Schematic of the sensitive parts with the spider joint; (b) working principle; (c) photographs and scanning electron microscope (SEM) images of the crack-based sensor

Figure 2. Schematics of the working principle for strain and pressure sensors. (a) Schematic of VN/CNTs hybrid structure; (b) schematic of slip VN/CNTs multilayer structure[27]; (c) schematic of working principle for pressure sensors[28]

Figure 3. The performance index of piezoresistive sensors. (a) Flexible electronic devices can maintain good morphology under stretching[29]; (b) the sensor is divided into different working ranges, corresponding to different linearity and GF[31]; (c) hysteresis curve of flexible sensor[32]; (d) cycle stability of flexible sensor; (e) response time of flexible sensor[33]; (f, g) detection of object spatial configuration by sensor array[34]

Figure 4. Flexible substrate materials[1]

Figure 5. One-dimensional and two-dimensional materials used in the preparation of flexible sensors. (a) Schematic depiction of the SPIS sensor fabrication process and working mechanism[36]; (b) structure and operating principle of MXene/BP-based pressure sensor[37]

Figure 6. Conductive polymers and liquid metals used in the preparation of flexible sensors. (a) Stretching mechanism and image of active-matrix transistor strain sensor array[38]; (b) tilt sensor used in wearable body condition sensor system[39]

Figure 7. PINF/MXene aerogel piezoresistive sensor prepared by co-blend[45]. (a) Schematic of the preparation process; (b) schematic of working mechanism

Figure 8. Schematic of CB/dPDMS composites structure and working mechanism[46]. (a) Liquid-like property; sensing mechanism in initial state (b) and reconstruction state (c); (d) self-repair mechanism; (e) recovery mechanism

Figure 9. Dual-function piezoresistive sensor prepared by spin- coating[51]. (a) Schematic of preparation process; schematic (b) and images (c) of the sensor; SEM images of surface (d) and cross section (e) for the AgNPs thin layer

Figure 10. Preparation of thickness-gradient piezoresistive sensor by drop-casting[52]. (a) Preparation of SWCNTs film; (b) thickness of the film; (c, d) micrographs of film surface; (e) the wrinkle wavelength of the film surface; (f, g) stretchability and cycle stability; (h) GF

Figure 11. Preparation of graphene-based piezoresistive sensor by bar-coating[26]. (a) Schematic of preparation process; (b) images of the sensor stretched; (c) images of the sensor attached conformally; (d) the microscope image; the resistance change rate (e) and GF (f) as a function of applied strain

Figure 12. Preparation of piezoresistive sensor by spray-coating[54]. (a) Schematic of preparation process; (b) in-situ cross-sectional SEM images and microstructure diagrams under different pressure; (c) current change rate as a function of pressure; (d) the response and recovery time; (e) cycle stability

Figure 13. Preparation of piezoresistive flexible sensor based on electrostatic adsorption by LbL assembly. (a, c) Schematic of preparation; (b) resistance change rate as a function of bending strain[57]; (d) images of MXene sheet assembled on various substrates; resistance change rate as a function of bending curvature (e) and of applied strain (f); (g, h) SEM images[53]

Figure 14. Preparation of AgNPs conductive film based on ligand exchange by LbL assembly[60]. (a) Schematic of LbL assembly; (b) SEM image; (c) sheet resistance and electrical conductivity as a function of n

Figure 15. Preparation of piezoresistive flexible sensor by DIW[72]. (a) Image and schematic of PDMS network printed by DIW; (b) schematic of AgNPs were reduced

Figure 16. Preparation of piezoresistive flexible sensor by DIW[73]. (a) Schematic of DIW device; (b) working mechanism of sensor

Figure 17. Preparation of piezoresistive flexible sensors by electroless deposition[80]. (a) Schematic of the preparation process; (b) SEM images; (c) resistance change rate as a function of applied strain; (d, e) schematic of the structural change under stretching

Figure 18. Preparation of pressure-based piezoresistive flexible sensors by electrostatic spinning[81]. (a) Structure diagram of AgNWs/GR/PANFs nano-network; (b) images of AgNWs/GR/PANFs sensor; (c~e) schematic of preparation for electrode and sensitive layer of sensor; (f) the working mechanism of the sensor

Methods	Conductive materials	Sensitivity (GF)	Range	Linearity	Response time	Cyclic stability	Ref.
co-blend	MWCNTs	0.34 kPa^-1 (10~100 kPa)	0~100 kPa	R²=0.998 (10~100 kPa)	48 ms (0~20 kPa)	1000 cycles (0~100 kPa)	[34]
Consecutive batch deposition (CBD)	AuNPs	126 (0%~0.63%)	0%~0.63%	Not known	16.1 ms	2000 bending cycles	[79]
Spin coating	AgNPs	10 (0%~24%) 71 (24%~32%), 550 (32%~36%)	0%~36%	Three consecutive linearity region	125 ms	Not known	[47]
Drop casting	CNTs	161 (ε<2%), 9.8 (2%<ε<15%), 0.58 (ε>15%)	0%~150%	Not known	Not known	100,000 cycles (ε=60%), 20,000 cycles (ε=100%)	[52]
Bar coating	Graphite	522.6 (50%)	0%~50%	Not known	Not known	Not known	[26]
Spray coating	MXene	151.4 kPa^-1 (0~4.7 kPa), 33.8 kPa^-1 (>4.7 kPa)	0~15 kPa	Two consecutive linearity region	<130 ms	10,000 cycles (0~3.36 kPa)	[54]
Screen printing	MXene- AgNWs- Nano- composite	220.8 (0%~5%), 560.5 (5%~27%), 930.5 (27%~53%), 1933.3 (53%~62%)	0%~62%	0.97 (0%~5%), 0.99 (5%~62%)	1.8 s	1000 cycles (0%~15%)	[31]
LbL assembly	AuNPs	17 (0%~3%)	0%~3%	Linearity (0%~3%)	Not known	Not known	[57]
LbL assembly	MXene	22.5 (40%)	0%~20%	Not known	Not known	2000 cycles (0%~20%)	[58]
DIW	AgNPs	≈10 (1%~5%) ≈53 (20%~30%)	0%~30%	Not known	Not known	Not known	[72]
DIW	Graphite	536.61 (0.32%~0.62%)	–0.6%~0.6%	Three consecutive linearity region	110 ms	10,000 cycles (–0.32%~0%, 0%~0.32%)	[66]
Electroless deposition	(PS@Ni@Au)MPs	56.8 (0%~5%) 14.28 (0%~40%)	0%~42%	Not known	Not known	2500 cycles (0%~15%)	[80]
Electrostatic spinning	AgNWs/ GR	134 kPa^-1 (0~1.5 kPa)	3.7 Pa~75 kPa	Three consecutive linearity region	<20 ms	8000 cycles (0~2 kPa)	[81]
Solvent evaporation	Ionic liquid	3.25 (0%~200%)	0%~200%	Linearity	Not known	22,503 cycles (0%~100%)	[75]

Table 1. Comparison of performance index with sensors based on different solution-processed methods

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溶液法制备柔性压阻式传感器的研究进展

Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing

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[1]	Qian Xin, Su Meng, Li Fengyu, Song Yanlin. Research Progress in Flexible Wearable Electronic Sensors [J]. Acta Chim. Sinica, 2016, 74(7): 565-575.
[2]	Fu Yu, Wang Fang, Zhang Yan, Fang Xu, Lai Wenyong, Huang Wei. Research Progress of Non-Fullerene Small-Molecule Acceptor Materials for Organic Solar Cells [J]. Acta Chimica Sinica, 2014, 72(2): 158-170.