Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing
Received date: 2021-08-31
Online published: 2021-12-29
Supported by
National Natural Science Foundation of China(51873088); National Natural Science Foundation of China(12004195); Natural Science Foundation of Tianjin, China(18JCZDJC38400); Natural Science Foundation of Tianjin, China(20JCQNJC01820); “111” Project of China’s Higher Education(B18030); Fundamental Research Funds for the Central Universities from Nankai University(63201061); Fundamental Research Funds for the Central Universities from Nankai University(63211044)
Flexible piezoresistive sensors have received great attention due to their simple structure, easy preparation, and wide range of detection, and played an indispensable role in the field of wearable electronics. Solution-based processing has emerged as one of the promising techniques for sensors with advantages of simple operation, mild reaction conditions, wide-material choices, and large-scale fabrication. Furthermore, the mechanical and electrical performances of these sensors have been continuously optimized by a range of approaches. In addition, it allows the patterning of large-area sensor arrays, which expand their practical applications. In this review, an overview of the working mechanism and performance metrics of piezoresistive sensors is provided with detailed explanations of their influences on real applications. Then, the materials used for sensors preparation are introduced. Subsequently, the recent research progress of flexible piezoresistive sensors fabricated by solution-based processing is summarized. Several important solution-based methods are compared to illustrate their advantages and challenges. This review is concluded with a prospect of future development in the field of flexible solution-processed sensors.
Yurou Wang , Guoqi Wang , Xiang Li , Jun Yin , Jian Zhu . Research Progress of Flexible Piezoresistive Sensors Prepared by Solution-Based Processing[J]. Acta Chimica Sinica, 2022 , 80(2) : 214 -228 . DOI: 10.6023/A21080414
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