Soluble phenolic resin was synthesized by phenol and formaldehyde with NH4OH catalyst. Porous polyacenic semiconductor carbon (PPAS) materials were prepared by heat treatment of phenol formaldehyde (PF) resin doped with different contents of a foaming agent (ZnCl2) at lower temperatures (500～900 ℃) in inert gas atmosphere. The structure of the synthesized materials was characterized by means of FTIR, XRD, TG, SEM and other analysis methods. The effects of the foaming agent on the structure of PPAS were studied in detail. The experimental results showed that doping the foaming agent, on one hand, could increase the dehydration speed of pyrolysis processing of PF resin, and decrease the pyrolysis temperatures of it at the same time; on the other hand, the structures changed greatly in crystallite sizes and interlayer spaces for doped pyrolysis materials. Furthermore, when PF resin was doped with the foaming agent, the pyrolysis materials showed the ball or ellipsoid states, however, the un-doped pyrolysis materials showed the bulky and amorphous states with sharp edges and angles. The surface area measurements (BET method) showed that when resin-ZnCl2 ratio was 1∶3 (mass ratio), and the speed of heat treatment, 30 ℃/h, and the pyrolysis temperature, 600 ℃, the specific surface area could increase to 2150 m2•g－1, and the average diameter of the powders got to 11 Å.

Key words: phenol formaldehyde resin, conducting polymer, foaming agent, zinc chloride, porous carbonaceous material