印刷电路板中环氧树脂热解的ReaxFF反应动力学模拟
刁智俊, 赵跃民, 陈博, 段晨龙
Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field
Diao Zhijun, Zhao Yuemin, Chen Bo, Duan Chenlong
化学学报
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2012, (19): 2037
-2044
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DOI: 10.6023/A12070451
