CuCl2 硅溶胶和水溶液中铜的电化学行为研究

doi:10.6023/A1111151

化学学报 ›› 2012, Vol. 70 ›› Issue (07): 831-837 .DOI: 10.6023/A1111151 上一篇下一篇

研究论文

CuCl₂ 硅溶胶和水溶液中铜的电化学行为研究

冯砚艳, 辜敏, 杜云贵

重庆大学复杂煤气层瓦斯抽采国家地方联合工程实验室重庆大学煤矿灾害动力学与控制国家重点实验室重庆 400044

投稿日期:2011-11-15 修回日期:2012-02-12 发布日期:2012-02-21
通讯作者: 辜敏, 杜云贵
基金资助:
重庆市科委科技计划项目院士专项(No. 2008BC4003)和厦门大学表面物理化学国家重点实验室2007 年度开放课题(No. 200703)资助项目.

Electrochemical Behavior of Copper in CuCl₂ Silica Sol and Aqueous Solutions

Feng Yanyan, Gu Min, Du Yungui

State and Local Joint Engineering Laboratory of Methane Drainage in Complex Coal Gas Seam, State Key Laboratory of Coal Mine Disaster Dynamics and Control, Chongqing University, Chongqing 400044

Received:2011-11-15 Revised:2012-02-12 Published:2012-02-21
Supported by:
Project was supported by the Chongqing Science and Technology Commission of Science and Technology Project of Academician Special (No. 2008BC4003) and the Foundation of State Key Laboratory of Physical Chemistry of Solid Surfaces of Xiamen University (No. 200703).

文章分享

摘要/Abstract

采用循环伏安法和计时安培法研究了CuCl₂ 硅溶胶和水溶液中铜在玻碳电极上的电沉积和电结晶行为. 结果表明在两种CuCl₂电解质中, 铜的电沉积分两个步骤完成, Cu2⁺还原为Cu＋在硅溶胶中较水溶液中容易; 采用吸附-成核模型解析电流-时间暂态曲线, 并确定铜的电结晶机理为扩散控制下的连续成核三维生长(3DP), Cu2⁺在水溶液中的扩散系数较硅溶胶中的大, 但相同电位下在硅溶胶中的饱和成核数密度高于水溶液中.

关键词: 电结晶, 电流-时间暂态曲线(CTTs), 硅溶胶, 水溶液, CuCl₂, 铜

Electrodeposition and electrocrystallization of copper on glass carbon electrode from both CuCl₂ silica sols and aqueous solutions were investigated by utilizing cyclic voltammetry and chronoamperometry, respectively. The experiment results indicated that copper electrodeposition involved the two-step reaction in both electrolytes, and the deposition rate determining step (Cu²⁺ reduced to Cu⁺) in silica sol was easier than that in aqueous solution. An adsorption-nucleation model was proposed to analyze quantitatively the current-time transients (CTTs), which could separate the i_DL and i_nucleation perfectly. By the proposed model, copper electrocrystallization mechanism was characterized as progressive nucleation with 3D growth (3DP) under diffusion control. The diffusion coefficient of copper ions in silica sol was smaller than that in aqueous solution. However, the saturated nuclear number density in sol was larger than that in the aqueous solution at the same potential.

Key words: electrocrystallization, current-time transients (CTTs), silica sol, aqueous, CuCl₂, copper

引用此文

冯砚艳, 辜敏, 杜云贵. CuCl₂ 硅溶胶和水溶液中铜的电化学行为研究[J]. 化学学报, 2012, 70(07): 831-837 .

Feng Yanyan, Gu Min, Du Yungui. Electrochemical Behavior of Copper in CuCl₂ Silica Sol and Aqueous Solutions[J]. Acta Chimica Sinica, 2012, 70(07): 831-837 .

导出引用 EndNote|Reference Manager|ProCite|BibTeX|RefWorks

分享此文

参考文献

1 Shacham, R.; Avnir, D.; Mandler, D. Adv. Mater. 1999, 11,384.

2 Sheffer, M.; Groysman, A.; Mandler, D. Corros. Sci. 2003,45, 2893.

3 Shacham, R.; Mandler, D.; Avnir, D. Chem. Eur. J. 2004,10, 1936.

4 Walcarius, A.; Sibottier, E. Electroanalysis 2005, 17, 1716.

5 Jia, W.-Z.; Wang, K.; Zhu, Z.-J.; Song, H.-T.; Xia, X.-H. Langmuir 2007, 23, 11896.

6 Yang, S.; Jia, W.-Z.; Qian, Q.-Y.; Zhou, Y.-G.; Xia, X.-H. Anal. Chem. 2009, 81, 3478.

7 Okner, R.; Domb, A. J.; Mandler, D. New J. Chem. 2009,33, 1596.

8 Li, Y.; Jia, W.-Z.; Song, Y.-Y.; Xia, X.-H. Chem. Mater.2007, 19, 5758.

9 Li, Y.; Song, Y.-Y.; Yang, C.; Xia, X.-H. Electrochem. Commun. 2007, 9, 981.

10 Toledano, R.; Shacham, R.; Avnir, D.; Mandler, D. Chem. Mater. 2008, 20, 4276

11 Toledano, R.; Mandler, D. Chem. Mater. 2010, 22, 3943.

12 Grujicic, D.; Pesic, B. Electrochim. Acta 2002, 47, 2901.

13 Gu, M.; Li, Q.; Xian, X.-H.; Qing, S.-L.; Liu, K.-W. Acta Chim. Sinica 2007, 65, 881 (in Chinese). (辜敏, 李强, 鲜晓红, 卿胜兰, 刘克万, 化学学报, 2007,65, 881.)

14 Gu, M.; Li, Q.; Fu, B.-H.; Xian, X.-H. Trans. Inst. Met. Finish. 2010, 88, 144.

15 Zhong, Q. M.S. Thesis, Chongqing University, Chongqing,

2010 (in Chinese). (钟琴, 硕士论文, 重庆大学, 重庆, 2010.)

16 Tan, M.; Guymon, C.; Wheeler, D. R.; Harb, J. N. J. Electrochem. Soc. 2007, 154, D78.

17 Majidi, M. R.; Asadpour-Zeynali, K.; Hafezi, B. Electrochim. Acta 2009, 54, 1119.

18 Crousier, J.; Pardessus, L.; Crousier, J. P. Electrochim. Acta1988, 33, 1039.

19 Crousier, J.; Bimaghra, I. Electrochim. Acta 1989, 34, 1205.

20 Kekesi, T.; Isshiki, M. J. Appl. Electrochem. 1997, 27, 982.

21 Scendo, M.; Malyszko, J. J. Electrochem. Soc. 2000, 147,1758.

22 Abbott, A. P.; Ttaib, K. E.; Frisch, G.; McKenzie, K. J.; Ryder, K. S. Phys. Chem. Chem. Phys. 2009, 11, 4269.

23 Pasquale, M. A.; Gassa, L. M.; Arvia, A. J. Electrochim. Acta 2008, 53, 5891.

24 Yin, M.-Z.; Yao, X.; Li, Z.-R.; Zhang, L.-Y. J. Xi'an Jiaotong Univ. 2002, 36, 847 (in Chinese). (殷明志, 姚熹, 李振荣, 张良莹, 西安交通大学学报,2002, 36, 847.)

25 Yang, J.; Chen, J.-R.; Zhang, J.-M.; Liu, Y. J. Xi'an Univ. Eng. Sci. Technol. 2007, 21, 126 (in Chinese). (杨靖, 陈杰瑢, 张建民, 刘羽, 西安工程科技学院学报,2007, 21, 126.)

26 Zhu, L.-Q.; Chen, H.-N.; Li, W.-P. Acta Aeronaut. Astronaut. Sin. 2009, 30, 2229 (in Chinese). (朱立群, 陈海宁, 李卫平, 航空学报, 2009, 30, 2229.)

27 Deng, W.; Liu, Z.-L.; Xiang, M.; Guo, H.-T. Electrochemistry1998, 4, 152 (in Chinese). (邓文, 刘昭林, 项民, 郭鹤桐, 电化学, 1998, 4, 152.)

28 Xu, J.-Y.; Yang, F.-Z.; Xie, Z.-X.; Zhou, S.-M. J. Xiamen Univ. (Nat. Sci. Ed.) 1994, 33, 647 (in Chinese). (许家园, 杨防祖, 谢兆雄, 周绍民, 厦门大学学报(自然科学版), 1994, 33, 647.)

29 Zhang, Y.-Z.; Fang, J.-F.; Zhou, S.-M. J. Xiamen Univ. (Nat. Sci. Ed.) 1980, 19, 63 (in Chinese). (张瀛洲, 方加福, 周绍民, 厦门大学学报(自然科学版),1980, 19, 63.)

30 Bard, A. J.; Faulkner, L. R. Electrochemical Methods Fundamentals and Applications, Translated by Shao, Y.-H.; Zhu, G.-Y.; Dong, X.-D.; Zhang, B.-L., Chemical Industry Press, Beijing, 2005, pp. 373～436 (in Chinese). (阿伦. J. 巴德, 拉里. R. 福克纳著, 电化学方法原理和应用, 邵元华, 朱果逸, 董献堆, 张柏林译, 化学工业出版社, 北京, 2005, pp. 373～436.)

31 H?lzle, M. H.; Retter, U.; Kolb, D. M. J. Electroanal. Chem. 1994, 371, 101.

32 Scharifker, B.; Hills, G. Electrochim. Acta 1983, 28, 879.

33 Bosco, E.; Rangarajan, S. K. J. Chem. Soc., Faraday Trans.1, 1981, 77, 1673.

34 Varela, F. E.; Gassa, L. M.; Vilche, J. R. Electrochim. Acta1992, 37, 1119.

35 Palomar-Pardavé, M.; Miranda-Hernández, M.; González, I.; Batina, N. Surf. Sci. 1998, 399, 80.

[1]	王志强, 苏进展. 磷酸钴修饰Cu₃V₂O₈/ZnO光阳极的动力学特性及光电化学水分解研究[J]. 化学学报, 2024, 82(1): 26-35.
[2]	鱼章龙, 李忠良, 杨昌江, 顾强帅, 刘心元. 铜催化的二醇类化合物对映选择性去对称化反应研究进展^★[J]. 化学学报, 2023, 81(8): 955-966.
[3]	刘嘉文, 林玮璜, 王惟嘉, 郭学益, 杨英. Cu_1.94S-SnS纳米异质结的合成及其光催化降解研究[J]. 化学学报, 2023, 81(7): 725-734.
[4]	孟庆端, 韩佳宏, 潘一骁, 郝伟, 范青华. C₁-对称手性氮杂环卡宾(NHC)配体的不对称合成及其催化性能研究^★[J]. 化学学报, 2023, 81(10): 1271-1279.
[5]	邱孔茜, 李杰, 马浩文, 周伟, 蔡倩. 捕捉环加成反应中的有机亚铜中间体构筑氮杂环化合物研究进展[J]. 化学学报, 2023, 81(1): 42-63.
[6]	贾亚辉, 李春生, 徐忠震, 刘伟, 高道伟, 陈国柱. 载体相变下Pt-TiO₂ SMSI研究及其对CO催化性能的影响[J]. 化学学报, 2022, 80(9): 1289-1298.
[7]	郑安妮, 金磊, 杨家强, 李威青, 王赵云, 杨防祖, 詹东平, 田中群. 聚合物材料表面化学镀铜的前处理研究进展[J]. 化学学报, 2022, 80(5): 659-667.
[8]	徐清浩, 魏立谱, 张震, 肖斌. 铜促进的锗亲电试剂与烷基溴合成四烷基锗^※[J]. 化学学报, 2022, 80(4): 428-431.
[9]	樊小勇, 张帅, 朱永强, 敬茂森, 王凯鑫, 张露露, 李巨龙, 许磊, 苟蕾, 李东林. 三维多孔铜和锌镀层协同构筑无枝晶锂金属电极[J]. 化学学报, 2022, 80(4): 517-525.
[10]	李玲玲, 刘宇, 宋术岩, 张洪杰. 配位环境可调的Cu单原子的合成及催化加氢性能研究^※[J]. 化学学报, 2022, 80(1): 16-21.
[11]	秦浩男, 王朝阳, 臧双全. 原子级结构精确Cu₁₃团簇的光致发光和电化学传感研究[J]. 化学学报, 2021, 79(8): 1037-1041.
[12]	满清敏, 付尊蕴, 刘甜甜, 郑明月, 蒋华良. Cu催化偶联反应合成烷基芳基醚的DFT机理研究[J]. 化学学报, 2021, 79(7): 948-952.
[13]	邓卓基, 欧阳溢凡, 敖运林, 蔡倩. 铜催化不对称去对称化分子内烯基C—N偶联反应[J]. 化学学报, 2021, 79(5): 649-652.
[14]	周家正, 徐啸, 段碧雯, 石将建, 罗艳红, 吴会觉, 李冬梅, 孟庆波. 铜锌锡硫硒薄膜太阳能电池一价金属替位的研究进展[J]. 化学学报, 2021, 79(3): 303-318.
[15]	肖国鹏, 乔韦军, 张磊, 庆绍军, 张财顺, 高志贤. 钙钛矿型甲醇水蒸气重整制氢催化材料的研究[J]. 化学学报, 2021, 79(1): 100-107.

CuCl₂ 硅溶胶和水溶液中铜的电化学行为研究

Electrochemical Behavior of Copper in CuCl₂ Silica Sol and Aqueous Solutions

PDF

可视化

摘要/Abstract

引用此文

分享此文

参考文献

相关文章 15

编辑推荐

相关统计

本文评价