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化学学报
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化学学报 ›› 2009, Vol. 67 ›› Issue (7): 618-622. 上一篇    下一篇

研究论文

聚天冬氨酸与钨酸钠复配对黄铜缓蚀作用的光电化学研究

徐群杰*,a 单贞华a 朱律均b 曹为民b 周国定a

  

  1. (a上海高校电力腐蚀控制与应用电化学重点实验室 上海电力学院 上海 200090)
    (b上海大学化学系 上海 200444)

  • 投稿日期:2008-06-13 修回日期:2008-09-28 发布日期:2009-04-14
  • 通讯作者: 徐群杰

Photoelectrochemical Study on the Complex of Poly-aspartate and Tungstate as Inhibitors against Brass Corrosion

Xu, Qunjie *,a Shan, Zhenhua a Zhu, Lüjun b Cao, Weimin b Zhou, Guoding a   

  1. (a Key Laboratory of Shanghai Institutes and Universities for Electric Power Corrosion Control and
    Applied Electrochemistry, Shanghai University of Electric Power, Shanghai 200090)
    (b Department of Chemistry, Shanghai University, Shanghai 200444)

  • Received:2008-06-13 Revised:2008-09-28 Published:2009-04-14

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被引次数

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应用光电化学的方法研究了两种环境友好型缓蚀剂聚天冬氨酸(PASP)和钨酸钠(Na2WO4)的单一配方及其复配对黄铜在含硼砂硼酸缓冲溶液的模拟水中的缓蚀作用. 结果表明, 在光电流循环伏安测试中, 单一的PASP与Na2WO4均能够使黄铜表面Cu2O膜引起的p-型光电流响应增大, 这说明缓蚀剂增大了Cu2O膜的厚度, 使黄铜的腐蚀速率减小. 单一的PASP与Na2WO4的最佳添加浓度分别为20与25 mg•L－1. 若以总浓度为20 mg•L－1时对两者进行复配, 当PASP与Na2WO4的质量比为1∶1时, 两者复配比单一使用时的p-型电流光响应都更大, 黄铜的腐蚀更小, 即缓蚀剂的效果更好.

关键词: 黄铜, 钨酸钠, 聚天冬氨酸, 光电化学, 腐蚀

Photoelectrochemical and electrochemical impedance measurements were conducted to study the effects of environment-friendly inhibitors poly-aspartate (PASP), Na2WO4 and their complexes on the corrosion of brass in a borax-buffer solution. The photoelectrochemical measurement results indicated that PASP or Na2WO4 increased the p-type photocurrent, which came from the Cu2O layer on the brass surface. It showed that the inhibitors increased the thickness of the Cu2O layer and decreased the corrosion rate. The optimal concentrations of PASP and Na2WO4 were 20 and 25 mg•L－1, respectively, and mono Na2WO4 increased much photocurrent than mono PASP did. Combining PASP and Na2WO4 at a total concentration of 20 mg•L－1, when the mass ratio (PASP∶Na2WO4) was 1∶1, the photocurrent increased more than that using the individual. The bigger the photocurrent was, the better the inhibition efficiency was.

Key words: brass, sodium tungstate, poly-aspartate, photoelectrochemistry, corrosion