Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application★

doi:10.6023/A25040140

Acta Chimica Sinica ›› 2025, Vol. 83 ›› Issue (8): 917-936.DOI: 10.6023/A25040140 Previous Articles Next Articles

Review

乙烷选择性金属有机框架材料的结构设计与分离应用^★

吴子林^†, 张璐^†, 陈杨, 李晋平, 李立博^*()

太原理工大学化学与化工学院太原 030024

投稿日期:2025-04-30 发布日期:2025-06-27
通讯作者: 李立博

作者简介:

吴子林, 太原理工大学化学与化工学院在读硕士研究生, 目前主要研究方向为MOF材料在气体吸附分离领域的应用.

张璐, 太原理工大学化学与化工学院在读博士研究生, 目前主要研究方向为MOF材料在气体吸附分离领域的应用.

陈杨, 研究员. 国家优秀青年基金、山西省优秀青年基金、煤炭学会青年科学技术奖优博奖、山西省优秀博士学位论文获得者. 从事多孔材料(MOFs, 分子筛等)的制备、功能化, 以及能源环境气体的分离与纯化研究. 主要研究包括柔性MOF应用于氨气的吸附与脱除; 利用MOF材料结构多样并可调控和修饰的优势, 探究不同MOF结构和气体分离之间的构效关系, 以实现CO₂, CH₄, C₂H₄和C₃H₆等气体的高效分离.

李晋平, 太原理工大学化学化工学院, 工学博士, 教授, 博士生导师, 新世纪百千万人才工程国家级人选, 享受国务院政府特殊津贴专家. 现任太原理工大学党委副书记, 气体能源高效清洁利用山西省重点实验室主任, 山西省煤层气高效开采与利用协同创新中心主任, 国家自然科学基金委化学部会评专家, 兼任Chin. J. Chem. Eng.和《过程工程学报》期刊编委, 《煤炭转化》期刊主编. 作为主要完成人获得国家技术发明二等奖1项, 山西省技术发明一等奖1项, 省部级自然科学二等奖3项. 先后获得“第九届侯德榜化工科学技术奖-创新奖”、“新世纪学术技术带头人333人才省级人选”、“山西省五一劳动奖章”和“山西省高等学校中青年拔尖创新人才”等荣誉称号.

李立博, 太原理工大学化学化工学院, 教授, 博士生导师. 国家优秀青年基金、山西省杰出青年基金获得者, “三晋英才”拔尖骨干人才, 山西省青年拔尖人才, 中国化学学会青年委员, 分子辨识分离工程专业委员会副秘书长. 长期从事新型多孔材料制备、功能化及气体分离领域研究, 在Science、J. Am. Chem. Soc.、Angew. Chem., Int. Ed.、Adv. Mater.、AIChE. J.等国际知名期刊发表学术论文100余篇, 引用10000余次, 获授权国家发明专利16项. 主持国家自然科学基金(优青、面上), 国家重点研发计划项目课题, 山西省煤基重点科技攻关等项目.

†共同第一作者.

^★ “中国青年化学家”专辑.

基金资助:
国家重点研发计划(2022YFB3806800); 国家自然科学基金(22422810); 国家自然科学基金(22278287); 国家自然科学基金(22090062); 山西省基础研究计划项目(202203021223004)

Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application^★

Zilin Wu, Lu Zhang, Yang Chen, Jinping Li, Libo Li^*()

College of Chemistry and Chemical Engineering, Taiyuan University of Technology, Taiyuan, Shanxi 030024

Received:2025-04-30 Published:2025-06-27
Contact: Libo Li
About author:
†The authors contributed equally to this work.
^★ For the VSI “Rising Stars in Chemistry”.
Supported by:
National Key R&D Program of China(2022YFB3806800); National Natural Science Foundation of China(22422810); National Natural Science Foundation of China(22278287); National Natural Science Foundation of China(22090062); Shanxi Provincial Basic Research Program(202203021223004)

Ethylene (C₂H₄) serves as a core raw material in the modern chemical industry, where its efficient separation and purification are of paramount importance. Compared to traditional distillation technology, adsorption separation technology offers significant advantages, including reduced energy consumption, lower costs, and simpler operational procedures. Ethane (C₂H₆)-selective adsorbents can directly obtain high-purity C₂H₄ through a single-step adsorption, simplifying the separation process and reducing energy consumption. Developing efficient C₂H₄ separation and purification technologies is a major demand for energy conservation, consumption reduction and green development in the chemical industry. The key to this research lies in the design and preparation of high-performance C₂H₆-selective adsorbents. The advent of Metal-organic framework (MOF), characterized by their high designability and adjustability, has significantly advanced the research and development of C₂H₆-selective adsorbents. By strategically designing active sites and precisely controlling pore environments, a diverse range of C₂H₆-selective adsorbents have been continuously developed. However, when facing actual separation systems and complex industrial application scenarios, the performance of these materials still needs to be improved, and there is an urgent need for further systematic research on the structure-activity relationship of the C₂H₆ adsorption mechanism. This study provides a comprehensive review of the research progress in C₂H₆-selective adsorbents over the past 15 years, delving into their structural design methodologies, such as flexible gate-opening effects, metal site modifications, and surface potential regulation. It also elaborates in detail on the influence mechanisms of different methods on the adsorption selectivity and capacity. In addition, it emphasizes the key challenges that C₂H₆-adsorbents must overcome in the face of industrial applications, including cyclic stability, green large-scale synthesis, and the establishment of new separation processes. It is expected to lay a theoretical foundation for the precise construction and separation application of high-performance C₂H₆-adsorbents, and to promote the technological innovation and transformative development of the olefin separation industry.

Key words: ethane-selective adsorbent, adsorptive separation, metal-organic framework, structural design, alkane recognition mechanism

Cite this article

Zilin Wu, Lu Zhang, Yang Chen, Jinping Li, Libo Li. Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application^★[J]. Acta Chimica Sinica, 2025, 83(8): 917-936.

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MOF材料	吸附机理	BET/ (m²•g^－1)	孔容/ (cm³•g^－1)	孔径/ (Å or Å×Å)	吸附量(mmol/g) (298 K, 1 bar)		IAST选择性 (50:50, 298 K, 1 bar)	参考文献
MOF材料	吸附机理	BET/ (m²•g^－1)	孔容/ (cm³•g^－1)	孔径/ (Å or Å×Å)	C₂H₄	C₂H₆	IAST选择性 (50:50, 298 K, 1 bar)	参考文献
ZIF-7	柔性“开门”效应	—	—	—	1.90	2.00	2.5	[25]
IRMOF-8	孔表面调控	1360	0.69	12.6	3.20	4.00	1.75	[26]
MAF-49	限域空间	—	—	—	1.69	1.72	2.71	[23]
Ni(bdc)(ted)_0.5	孔表面调控	1701	0.79	7.94	3.40	5.00	1.85	[27]
PCN-250	孔表面调控	1470	0.56	5.9/6.8/9.3	4.22	5.21	1.9	[29]
Cu(Qc)₂	孔表面调控	240	0.11	3.3	0.78	1.85	3.4	[24]
Fe₂(O₂)(dobdc)	金属空位点修饰	1073	—	—	2.55	3.32	4.4	[6]
NbU-5	金属空位点修饰	671	—	4-5	3.04	3.39	—	[44]
NOTT-101	金属空位点修饰	2930	—	7.3/13.6	6.92	7.59	—	[44]
Ni(TMBDC)(DABCO)_0.5	孔表面调控	894	0.39	5.9	5.02	5.45	1.99^a	[69]
MUF-15	孔表面调控	1130	0.51	8.5×3.5	4.15^b	4.69^b	1.96^b	[49]
MOF-801	孔表面调控	861	—	4.7	2.10	2.59	2.1	[70]
JNU-2	限域空间	1219	0.56	3.4/4.6/6.7	3.62	4.11	1.6	[62]
CPM-223	金属空位点修饰	1461	—	6.8	6.34	6.91	1.57	[39]
CPM-223-tpbz	金属空位点修饰	1662	—	6.8	6.25	6.88	1.51	[39]
CPM-223-tppy	金属空位点修饰	1599	—	6.8	7.17	7.34	1.28	[39]
CPM-233	金属空位点修饰	1598	—	6.8	6.52	7.45	1.64	[39]
CPM-238	金属空位点修饰	1444	—	5.9	5.25	5.56	1.43	[39]
CPM-723	金属空位点修饰	1370	—	6.8	6.67	6.91	1.5	[39]
CPM-733	金属空位点修饰	1329	—	7.3	6.37	7.13	1.75	[39]
CPM-736	金属空位点修饰	473	—	5.9	3.88	4.03	1.48	[39]
CPM-738	金属空位点修饰	1162	—	5.9	4.56	4.67	1.42	[39]
Cd-PNMI	孔表面调控	264	—	8.5×12.6	1.41	1.87	1.27^c	[71]
Mn-PNMI	孔表面调控	818	—	9.1×13.3	2.02	2.76	1.38^c	[71]
Zn-PNMI	孔表面调控	305	—	8.3×11.8	1.46	1.63	1.42^c	[71]
NIIC-20-Bu	限域空间	1033	0.555	2	1.4	2.5	15.4	[72]
NIIC-20-Et	限域空间	1161	0.836	5.5	1.8	2.4	3.5	[72]
NIIC-20-GI	限域空间	963	0.567	5.4	1.7	2.1	8.7	[72]
NIIC-20-Pe	限域空间	1023	0.567	1.8	1.6	2.2	8.4	[72]
NIIC-20-Pr	限域空间	1117	0.773	5	1.9	2.4	4	[72]
NPU-1	孔表面调控	1396	0.47	4.8	4.20	4.50	1.32	[73]
NPU-2	孔表面调控	1580	0.66	6	3.45	4.44	1.52	[73]
NPU-3	孔表面调控	1834	0.77	7.8	2.22	3.36	3.21	[73]
LIFM-31	金属空位点修饰	1711	0.71	6.8/11.8	1.80	2.40	1.4	[40]
LIFM-61	金属空位点修饰	1194	0.49	7.3/11.8	1.40	1.70	1.3	[40]
LIFM-62	金属空位点修饰	1977	0.82	5.9/11.7	2.00	2.60	1.4	[40]
LIFM-63	金属空位点修饰	1486	0.62	5.6/8.6	2.10	3.00	1.6	[40]
MOF-525	金属空位点修饰	3116	—	—	2.11	2.71	1.46	[74]
MOF-525(Co)	金属空位点修饰	2934	—	—	1.92	2.22	1.87	[74]
UPC-612	金属空位点修饰	2016	—	14/20	2.79	3.58	1.4	[74]
UPC-613	金属空位点修饰	853	—	7/12	2.31	2.55	1.48	[74]
Ni(IN)₂	孔表面调控	520	0.305	6	3.03	3.05	2.44	[50]
SNNU-40	孔表面调控	2234	1.22	6.5	4.91	7.54	1.58	[75]
NKMOF-8-Br	孔表面调控	352	0.21	6.6	3.67	4.22	2.65	[47]
NKMOF-8-Me	孔表面调控	655	0.3	5.9	4.67	4.82	1.88	[47]
Co(AIN)₂	孔表面调控	450	0.19	6	3.14	3.17	2.96	[46]
Zn-atz-oba	限域空间	711	0.287	3.2/4.4	2.03	2.05	1.27	[63]
Zn₂(BDC)(H₂BPZ)_0.5(HBPZ)(BPZ)_0.5	孔表面调控	977	0.47	8.8~10.2	3.26	3.47	1.5	[76]
BIF-108-Zn	金属空位点修饰	708	0.39	6.4	2.75	2.80	1.37	[43]
UiO-67-(NH₂)₂	孔表面调控	2022	0.8	11.5/7.5/6.8	4.32^d	5.32^d	1.7^d	[54]
MOF-841	孔表面调控	1426	0.53	8.5	3.40	4.70	1.6	[77]
Zn-FBA	孔表面调控	297	—	6	1.14	1.25	2.9	[48]
Zn-(BDC)(H₂BPZ)	孔表面调控	907	—	8.0~10.2	3.29	3.63	2.2	[45]
CuTiF₆-TPPY	孔表面调控	685	0.32	6	2.42	2.82	2.12	[78]
Zn(ad)(int)	限域空间	617	—	8	2.14	2.32	2.4	[61]
Zn-ATA	限域空间	—	—	3.5	1.20	1.10	1.75	[79]
FJI-H11-Me	孔表面调控	—	—	—	2.08	2.59	2.09^e	[80]
PCP-IPA	限域空间	—	0.19	4.7×5.6	2.13	2.50	2.8	[64]
UPC-66-a	柔性“开门”效应	483	—	7	2.41^b	2.72^b	1.65^b	[81]
Tb-MOF-76(NH₂)	孔表面调控	—	—	8.2	2.97	3.27	2.1	[53]
NKMOF-14-PZ	限域空间	1561	—	8	3.44	5.64	1.89	[82]
NKMOF-14-PD	限域空间	1449	—	8	3.39	5.34	1.96	[82]
UiO-66-CF₃	孔表面调控	487	—	6.1	1.13	1.47	1.9	[56]
PCP-IPA-NH₂	孔表面调控	387	0.13	3.8×5.6	1.80	1.94	2.19	[83]
PCP-FDCA	孔表面调控	542	0.17	3.3×5.2	3.08	3.17	1.65	[83]
Zn₂(oba)₂(dmimpym)	孔表面调控	354	—	10~13	2.16	2.52	1.8	[84]
Ni-MOF 2	孔表面调控	1501	—	8.1	4.69	5.94	1.9	[60]
HIAM-210	孔表面调控	566	0.24	4.02	2.12	2.34	2	[85]
TKL-105	孔表面调控	1509	—	6.2	4.44	5.62	1.37	[86]
TKL-106	孔表面调控	1636	—	6.1	4.51	5.61	1.5	[86]
TKL-107	孔表面调控	1454	—	6	5.24	6.00	1.36	[86]
HIAM-326	孔表面调控	388	0.243	5.05	1.87	2.28	1.9	[87]
JNU-6	孔表面调控	1411	0.59	5.4	3.77	5.07	1.47	[88]
JNU-6-CH₃	孔表面调控	1270	0.51	4.1	3.93	4.63	1.67	[88]
Y-TATB	限域空间	1562	0.62	7.5/12	2.98	4.32	1.87	[66]
MOF-808	孔表面调控	1542	—	7.3/18	1.05	1.14	1.05	[55]
MOF-808-Ind	孔表面调控	948	—	12/14.8	1.39	1.68	1.23	[55]
MOF-808-bzz	孔表面调控	1003	—	—	2.20	1.90	1.9	[55]
MOF-808-lzo	孔表面调控	1130	—	—	1.56	1.74	1.22	[55]
Zn-trz-ox	孔表面调控	561	—	5.42	4.10	4.21	2.15	[89]
UiO-66-2Me_0.5	孔表面调控	944	0.39	9.7	—	1.85	1.82	[90]
UiO-66-2Me	孔表面调控	755	0.3	9.1	—	2.15	2.93	[90]
FJI-W-66	柔性“开门”效应	329	—	5.2/4.4	1.29	1.32	1.39	[91]
Zn-fa-datz(1)	孔表面调控	—	—	6.1	1.69	1.97	1.6	[92]
Zn-fa-atz(2)	孔表面调控	—	0.283	6.3	1.50	1.40	1.4	[92]
X-dia-1-Ni	柔性“开门”效应	—	—	—	1.58^f	5.54^f	3.72^f	[35]
X-dia-1-Ni_0.89Co_0.11	柔性“开门”效应	—	—	—	0.54^f	4.96^f	5.47^f	[35]
MAC-4	孔表面调控	1180	—	6.4/10.8	3.71	4.78	2	[93]
MAF-X10	孔表面调控	1644	0.67	4.9×6.8	3.57	5.07	1.5	[94]
MAF-X10(Me)	孔表面调控	1782	0.62	4.9×5.8	4.01	5.01	1.3	[94]
MAF-X10(Cl)	孔表面调控	1751	0.63	4.9×6.2	4.05	5.87	1.6	[94]
MAF-X10(F)	孔表面调控	1931	0.67	4.9×6.5	4.09	6.27	1.8	[94]
ZNU-10	限域空间	1171	0.45	8.59	1.57	2.13	1.64	[95]
Ni-bodc-tpt	金属空位点修饰	1094	—	5~7	4.72	5.87	1.8	[96]
V-bdc-tpt	金属空位点修饰	1720	0.68	5.0/6.4	7.13	7.45	1.43	[42]
V-bdc-tppy	金属空位点修饰	1670	0.66	5.0/6.2	6.31	6.45	1.34	[42]
V-bdc-tpbz	金属空位点修饰	1460	0.6	5.0/6.0	5.83	5.97	1.30	[42]
V-bpdc-tph	金属空位点修饰	2964	1.18	10.9	3.12	5.37	—	[42]
NTU-73-COOH	孔表面调控	228	0.039	5.3	0.58	0.53	0.66	[97]
NTU-73-CF₃	孔表面调控	889	0.153	7.7	2.77	2.80	1.18	[97]
NTU-73-CH₃	孔表面调控	1078	0.185	9.2	3.47	4.01	1.33	[97]
Zn-PCTF	限域空间	934	0.357	7.3/8	2.83	3.53	1.75	[98]
CuIn(3-ain)₄	限域空间	429	0.231	5.4	2.68	2.71	3.32	[65]
TJE-O	孔表面调控	492	—	7.6	3.04	2.99	1.69	[99]
TJE-S	孔表面调控	331	—	7.8	2.10	2.59	2.79	[99]
HIAM-316	孔表面调控	1110	—	5	2.01	2.76	1.67	[100]
NKPOC-DS	柔性“开门”效应	1016	—	5.7×3.6	2.38	2.75	1.43	[36]
TYUT-17	柔性“开门”效应	505	—	6.7	2.74	3.01	6.41^g	[38]
RT-Cu(Qc)₂	孔表面调控	251	0.132	—	0.56	2.04	4.00	[101]
CAU-23	孔表面调控	1240	0.42	5.7	3.80	4.00	1.54	[102]
Zn-BPZ-TATB	孔表面调控	1142	0.48	6.5/9.3	4.10	4.69	1.70	[103]
MOF-303	孔表面调控	1244	0.52	5.8	5.00	5.01	1.70	[104]
ZrT-1-ethenyl	限域空间	915	—	5.4/10.3	2.46	2.79	1.40	[105]
ZrT-1-alkyne	限域空间	951	—	5.6/10.3	2.24	2.53	1.93	[105]
Zn-CO₃-datz	限域空间	312	0.1795	5.9	1.69	1.80	1.71	[106]
CoV-zMA-tpt	金属空位点修饰	1679	0.651	6.3/7.8	5.98	6.61	1.54	[107]
CSMOF-C5	孔表面调控	—	—	6.1	1.94	2.41	1.56	[108]
MLMOF-C5	孔表面调控	—	—	5.4/8.4	1.61	2.69	2.25	[108]
CFA-Zn-OAc	孔表面调控	1875	0.64	6.8/10	3.16	3.97	1.49	[109]
CFA-Zn-OH	孔表面调控	2576	1.04	6.8/10.9	2.56	3.36	2.13	[109]
UPC-250	孔表面调控	1674	0.94	7.8	2.32	3.56	1.47	[110]
UPC-251	孔表面调控	1516	0.88	7.6	2.15	3.54	1.51	[110]
NTU-70P	孔表面调控	855	0.3411	6	3.74	4.03	2.6	[111]
NTU-101	柔性“开门”效应	760	0.132	—	3.20	3.26	—	[37]
NTU-101-NH₂	柔性“开门”效应	650	0.111	—	2.31	2.48	—	[37]
PAC-1	孔表面调控	346	—	13.1	1.90	2.09	1.4	[52]
JNU-74a	孔表面调控	1006	0.38	6.4-10.9	3.19	3.67	2.3	[112]
SMS-POC-1	孔表面调控	1921	—	—	3.33	4.33	2.4	[113]
ZnFPCP	孔表面调控	330	0.17	4.9/5.3	—	1.11	2.93	[114]
DMOF-TF-Cu	孔表面调控	994	0.43	7.2	2.59	3.40	1.6	[115]
DMOF-TF-Zn	孔表面调控	1360	0.52	7.5	2.91	4.04	1.7	[115]

MOF材料	吸附机理	BET/ (m²•g^－1)	孔容/ (cm³•g^－1)	孔径/ (Å or Å×Å)	吸附量(mmol/g) (298 K, 1 bar)		IAST选择性 (50:50, 298 K, 1 bar)	参考文献
MOF材料	吸附机理	BET/ (m²•g^－1)	孔容/ (cm³•g^－1)	孔径/ (Å or Å×Å)	C₂H₄	C₂H₆	IAST选择性 (50:50, 298 K, 1 bar)	参考文献
ZIF-7	柔性“开门”效应	—	—	—	1.90	2.00	2.5	[25]
IRMOF-8	孔表面调控	1360	0.69	12.6	3.20	4.00	1.75	[26]
MAF-49	限域空间	—	—	—	1.69	1.72	2.71	[23]
Ni(bdc)(ted)_0.5	孔表面调控	1701	0.79	7.94	3.40	5.00	1.85	[27]
PCN-250	孔表面调控	1470	0.56	5.9/6.8/9.3	4.22	5.21	1.9	[29]
Cu(Qc)₂	孔表面调控	240	0.11	3.3	0.78	1.85	3.4	[24]
Fe₂(O₂)(dobdc)	金属空位点修饰	1073	—	—	2.55	3.32	4.4	[6]
NbU-5	金属空位点修饰	671	—	4-5	3.04	3.39	—	[44]
NOTT-101	金属空位点修饰	2930	—	7.3/13.6	6.92	7.59	—	[44]
Ni(TMBDC)(DABCO)_0.5	孔表面调控	894	0.39	5.9	5.02	5.45	1.99^a	[69]
MUF-15	孔表面调控	1130	0.51	8.5×3.5	4.15^b	4.69^b	1.96^b	[49]
MOF-801	孔表面调控	861	—	4.7	2.10	2.59	2.1	[70]
JNU-2	限域空间	1219	0.56	3.4/4.6/6.7	3.62	4.11	1.6	[62]
CPM-223	金属空位点修饰	1461	—	6.8	6.34	6.91	1.57	[39]
CPM-223-tpbz	金属空位点修饰	1662	—	6.8	6.25	6.88	1.51	[39]
CPM-223-tppy	金属空位点修饰	1599	—	6.8	7.17	7.34	1.28	[39]
CPM-233	金属空位点修饰	1598	—	6.8	6.52	7.45	1.64	[39]
CPM-238	金属空位点修饰	1444	—	5.9	5.25	5.56	1.43	[39]
CPM-723	金属空位点修饰	1370	—	6.8	6.67	6.91	1.5	[39]
CPM-733	金属空位点修饰	1329	—	7.3	6.37	7.13	1.75	[39]
CPM-736	金属空位点修饰	473	—	5.9	3.88	4.03	1.48	[39]
CPM-738	金属空位点修饰	1162	—	5.9	4.56	4.67	1.42	[39]
Cd-PNMI	孔表面调控	264	—	8.5×12.6	1.41	1.87	1.27^c	[71]
Mn-PNMI	孔表面调控	818	—	9.1×13.3	2.02	2.76	1.38^c	[71]
Zn-PNMI	孔表面调控	305	—	8.3×11.8	1.46	1.63	1.42^c	[71]
NIIC-20-Bu	限域空间	1033	0.555	2	1.4	2.5	15.4	[72]
NIIC-20-Et	限域空间	1161	0.836	5.5	1.8	2.4	3.5	[72]
NIIC-20-GI	限域空间	963	0.567	5.4	1.7	2.1	8.7	[72]
NIIC-20-Pe	限域空间	1023	0.567	1.8	1.6	2.2	8.4	[72]
NIIC-20-Pr	限域空间	1117	0.773	5	1.9	2.4	4	[72]
NPU-1	孔表面调控	1396	0.47	4.8	4.20	4.50	1.32	[73]
NPU-2	孔表面调控	1580	0.66	6	3.45	4.44	1.52	[73]
NPU-3	孔表面调控	1834	0.77	7.8	2.22	3.36	3.21	[73]
LIFM-31	金属空位点修饰	1711	0.71	6.8/11.8	1.80	2.40	1.4	[40]
LIFM-61	金属空位点修饰	1194	0.49	7.3/11.8	1.40	1.70	1.3	[40]
LIFM-62	金属空位点修饰	1977	0.82	5.9/11.7	2.00	2.60	1.4	[40]
LIFM-63	金属空位点修饰	1486	0.62	5.6/8.6	2.10	3.00	1.6	[40]
MOF-525	金属空位点修饰	3116	—	—	2.11	2.71	1.46	[74]
MOF-525(Co)	金属空位点修饰	2934	—	—	1.92	2.22	1.87	[74]
UPC-612	金属空位点修饰	2016	—	14/20	2.79	3.58	1.4	[74]
UPC-613	金属空位点修饰	853	—	7/12	2.31	2.55	1.48	[74]
Ni(IN)₂	孔表面调控	520	0.305	6	3.03	3.05	2.44	[50]
SNNU-40	孔表面调控	2234	1.22	6.5	4.91	7.54	1.58	[75]
NKMOF-8-Br	孔表面调控	352	0.21	6.6	3.67	4.22	2.65	[47]
NKMOF-8-Me	孔表面调控	655	0.3	5.9	4.67	4.82	1.88	[47]
Co(AIN)₂	孔表面调控	450	0.19	6	3.14	3.17	2.96	[46]
Zn-atz-oba	限域空间	711	0.287	3.2/4.4	2.03	2.05	1.27	[63]
Zn₂(BDC)(H₂BPZ)_0.5(HBPZ)(BPZ)_0.5	孔表面调控	977	0.47	8.8~10.2	3.26	3.47	1.5	[76]
BIF-108-Zn	金属空位点修饰	708	0.39	6.4	2.75	2.80	1.37	[43]
UiO-67-(NH₂)₂	孔表面调控	2022	0.8	11.5/7.5/6.8	4.32^d	5.32^d	1.7^d	[54]
MOF-841	孔表面调控	1426	0.53	8.5	3.40	4.70	1.6	[77]
Zn-FBA	孔表面调控	297	—	6	1.14	1.25	2.9	[48]
Zn-(BDC)(H₂BPZ)	孔表面调控	907	—	8.0~10.2	3.29	3.63	2.2	[45]
CuTiF₆-TPPY	孔表面调控	685	0.32	6	2.42	2.82	2.12	[78]
Zn(ad)(int)	限域空间	617	—	8	2.14	2.32	2.4	[61]
Zn-ATA	限域空间	—	—	3.5	1.20	1.10	1.75	[79]
FJI-H11-Me	孔表面调控	—	—	—	2.08	2.59	2.09^e	[80]
PCP-IPA	限域空间	—	0.19	4.7×5.6	2.13	2.50	2.8	[64]
UPC-66-a	柔性“开门”效应	483	—	7	2.41^b	2.72^b	1.65^b	[81]
Tb-MOF-76(NH₂)	孔表面调控	—	—	8.2	2.97	3.27	2.1	[53]
NKMOF-14-PZ	限域空间	1561	—	8	3.44	5.64	1.89	[82]
NKMOF-14-PD	限域空间	1449	—	8	3.39	5.34	1.96	[82]
UiO-66-CF₃	孔表面调控	487	—	6.1	1.13	1.47	1.9	[56]
PCP-IPA-NH₂	孔表面调控	387	0.13	3.8×5.6	1.80	1.94	2.19	[83]
PCP-FDCA	孔表面调控	542	0.17	3.3×5.2	3.08	3.17	1.65	[83]
Zn₂(oba)₂(dmimpym)	孔表面调控	354	—	10~13	2.16	2.52	1.8	[84]
Ni-MOF 2	孔表面调控	1501	—	8.1	4.69	5.94	1.9	[60]
HIAM-210	孔表面调控	566	0.24	4.02	2.12	2.34	2	[85]
TKL-105	孔表面调控	1509	—	6.2	4.44	5.62	1.37	[86]
TKL-106	孔表面调控	1636	—	6.1	4.51	5.61	1.5	[86]
TKL-107	孔表面调控	1454	—	6	5.24	6.00	1.36	[86]
HIAM-326	孔表面调控	388	0.243	5.05	1.87	2.28	1.9	[87]
JNU-6	孔表面调控	1411	0.59	5.4	3.77	5.07	1.47	[88]
JNU-6-CH₃	孔表面调控	1270	0.51	4.1	3.93	4.63	1.67	[88]
Y-TATB	限域空间	1562	0.62	7.5/12	2.98	4.32	1.87	[66]
MOF-808	孔表面调控	1542	—	7.3/18	1.05	1.14	1.05	[55]
MOF-808-Ind	孔表面调控	948	—	12/14.8	1.39	1.68	1.23	[55]
MOF-808-bzz	孔表面调控	1003	—	—	2.20	1.90	1.9	[55]
MOF-808-lzo	孔表面调控	1130	—	—	1.56	1.74	1.22	[55]
Zn-trz-ox	孔表面调控	561	—	5.42	4.10	4.21	2.15	[89]
UiO-66-2Me_0.5	孔表面调控	944	0.39	9.7	—	1.85	1.82	[90]
UiO-66-2Me	孔表面调控	755	0.3	9.1	—	2.15	2.93	[90]
FJI-W-66	柔性“开门”效应	329	—	5.2/4.4	1.29	1.32	1.39	[91]
Zn-fa-datz(1)	孔表面调控	—	—	6.1	1.69	1.97	1.6	[92]
Zn-fa-atz(2)	孔表面调控	—	0.283	6.3	1.50	1.40	1.4	[92]
X-dia-1-Ni	柔性“开门”效应	—	—	—	1.58^f	5.54^f	3.72^f	[35]
X-dia-1-Ni_0.89Co_0.11	柔性“开门”效应	—	—	—	0.54^f	4.96^f	5.47^f	[35]
MAC-4	孔表面调控	1180	—	6.4/10.8	3.71	4.78	2	[93]
MAF-X10	孔表面调控	1644	0.67	4.9×6.8	3.57	5.07	1.5	[94]
MAF-X10(Me)	孔表面调控	1782	0.62	4.9×5.8	4.01	5.01	1.3	[94]
MAF-X10(Cl)	孔表面调控	1751	0.63	4.9×6.2	4.05	5.87	1.6	[94]
MAF-X10(F)	孔表面调控	1931	0.67	4.9×6.5	4.09	6.27	1.8	[94]
ZNU-10	限域空间	1171	0.45	8.59	1.57	2.13	1.64	[95]
Ni-bodc-tpt	金属空位点修饰	1094	—	5~7	4.72	5.87	1.8	[96]
V-bdc-tpt	金属空位点修饰	1720	0.68	5.0/6.4	7.13	7.45	1.43	[42]
V-bdc-tppy	金属空位点修饰	1670	0.66	5.0/6.2	6.31	6.45	1.34	[42]
V-bdc-tpbz	金属空位点修饰	1460	0.6	5.0/6.0	5.83	5.97	1.30	[42]
V-bpdc-tph	金属空位点修饰	2964	1.18	10.9	3.12	5.37	—	[42]
NTU-73-COOH	孔表面调控	228	0.039	5.3	0.58	0.53	0.66	[97]
NTU-73-CF₃	孔表面调控	889	0.153	7.7	2.77	2.80	1.18	[97]
NTU-73-CH₃	孔表面调控	1078	0.185	9.2	3.47	4.01	1.33	[97]
Zn-PCTF	限域空间	934	0.357	7.3/8	2.83	3.53	1.75	[98]
CuIn(3-ain)₄	限域空间	429	0.231	5.4	2.68	2.71	3.32	[65]
TJE-O	孔表面调控	492	—	7.6	3.04	2.99	1.69	[99]
TJE-S	孔表面调控	331	—	7.8	2.10	2.59	2.79	[99]
HIAM-316	孔表面调控	1110	—	5	2.01	2.76	1.67	[100]
NKPOC-DS	柔性“开门”效应	1016	—	5.7×3.6	2.38	2.75	1.43	[36]
TYUT-17	柔性“开门”效应	505	—	6.7	2.74	3.01	6.41^g	[38]
RT-Cu(Qc)₂	孔表面调控	251	0.132	—	0.56	2.04	4.00	[101]
CAU-23	孔表面调控	1240	0.42	5.7	3.80	4.00	1.54	[102]
Zn-BPZ-TATB	孔表面调控	1142	0.48	6.5/9.3	4.10	4.69	1.70	[103]
MOF-303	孔表面调控	1244	0.52	5.8	5.00	5.01	1.70	[104]
ZrT-1-ethenyl	限域空间	915	—	5.4/10.3	2.46	2.79	1.40	[105]
ZrT-1-alkyne	限域空间	951	—	5.6/10.3	2.24	2.53	1.93	[105]
Zn-CO₃-datz	限域空间	312	0.1795	5.9	1.69	1.80	1.71	[106]
CoV-zMA-tpt	金属空位点修饰	1679	0.651	6.3/7.8	5.98	6.61	1.54	[107]
CSMOF-C5	孔表面调控	—	—	6.1	1.94	2.41	1.56	[108]
MLMOF-C5	孔表面调控	—	—	5.4/8.4	1.61	2.69	2.25	[108]
CFA-Zn-OAc	孔表面调控	1875	0.64	6.8/10	3.16	3.97	1.49	[109]
CFA-Zn-OH	孔表面调控	2576	1.04	6.8/10.9	2.56	3.36	2.13	[109]
UPC-250	孔表面调控	1674	0.94	7.8	2.32	3.56	1.47	[110]
UPC-251	孔表面调控	1516	0.88	7.6	2.15	3.54	1.51	[110]
NTU-70P	孔表面调控	855	0.3411	6	3.74	4.03	2.6	[111]
NTU-101	柔性“开门”效应	760	0.132	—	3.20	3.26	—	[37]
NTU-101-NH₂	柔性“开门”效应	650	0.111	—	2.31	2.48	—	[37]
PAC-1	孔表面调控	346	—	13.1	1.90	2.09	1.4	[52]
JNU-74a	孔表面调控	1006	0.38	6.4-10.9	3.19	3.67	2.3	[112]
SMS-POC-1	孔表面调控	1921	—	—	3.33	4.33	2.4	[113]
ZnFPCP	孔表面调控	330	0.17	4.9/5.3	—	1.11	2.93	[114]
DMOF-TF-Cu	孔表面调控	994	0.43	7.2	2.59	3.40	1.6	[115]
DMOF-TF-Zn	孔表面调控	1360	0.52	7.5	2.91	4.04	1.7	[115]

乙烷选择性金属有机框架材料的结构设计与分离应用^★

Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application^★

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Fig. & Tab. 13

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乙烷选择性金属有机框架材料的结构设计与分离应用★

Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application★

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Abstract

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Fig. & Tab. 13

References 129

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乙烷选择性金属有机框架材料的结构设计与分离应用^★

Ethane-selective Metal-Organic Frameworks for Structural Design and Separation Application^★