Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

doi:10.6023/A22010026

Acta Chimica Sinica ›› 2022, Vol. 80 ›› Issue (5): 659-667.DOI: 10.6023/A22010026 Previous Articles Next Articles

Review

聚合物材料表面化学镀铜的前处理研究进展

郑安妮^a^,^b, 金磊^a^,^b, 杨家强^a^,^b, 李威青^a^,^b, 王赵云^a^,^b, 杨防祖^a^,^b^,^*(), 詹东平^a^,^b^,^*(), 田中群^a^,^b

a 厦门大学化学化工学院厦门 361005
b 厦门大学固体表面物理化学国家重点实验室厦门 361005

投稿日期:2022-01-14 发布日期:2022-05-31
通讯作者: 杨防祖, 詹东平

作者简介:

郑安妮, 厦门大学化学化工学院物理化学专业在读硕士研究生, 研究方向为非导电聚合物材料表面化学镀铜金属化.

杨防祖, 厦门大学化学化工学院教授, 福建省电镀及表面处理行业技术开发基地主任, 福建省表面工程行业协会副会长, 中国表面工程协会电镀分会理事, 《电镀与精饰》和《电镀与涂饰》期刊编委. 长期精深研究高端电子制造电子电镀、金属及合金的电沉积以及化学沉积和表面处理, 具有丰富扎实积累.

詹东平, 厦门大学化学化工学院教授, 博士生导师, 教育部新世纪优秀人才, 福建省杰出青年基金获得者, 《中国科学: 化学》、《Science China Chemistry》、《电化学》期刊编委. 从事高时空分辨电化学仪器、电化学微纳制造装备及高端电子制造电子电镀研究工作.

基金资助:
国家自然科学基金(22132003); 国家自然科学基金(21972118); 国家自然科学基金(21827802)

Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

Anni Zheng^a^,^b, Lei Jin^a^,^b, Jiaqiang Yang^a^,^b, Weiqing Li^a^,^b, Zhaoyun Wang^a^,^b, Fangzu Yang^a^,^b(), Dongping Zhan^a^,^b(), Zhongqun Tian^a^,^b

a College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China
b State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, China

Received:2022-01-14 Published:2022-05-31
Contact: Fangzu Yang, Dongping Zhan
Supported by:
National Natural Science Foundation of China(22132003); National Natural Science Foundation of China(21972118); National Natural Science Foundation of China(21827802)

Metallized polymer materials have been widely applied in the fields of communications, electronics and aerospace. Electroless copper plating is one of the important techniques for surface metallization of polymer materials. The pretreatments of polymer surface can directly affect the adhesion and levelness of the electroless copper coating. In this paper, we introduce in detail the kinds, compositions and properties of non-conductive polymer materials, and review the research progresses of the pretreatments for electroless copper plating on the non-conductive polymer materials’ surfaces.

Key words: non-conductive polymer material, surface, electroless copper plating, pretreatment, adhesion

Cite this article

Anni Zheng, Lei Jin, Jiaqiang Yang, Weiqing Li, Zhaoyun Wang, Fangzu Yang, Dongping Zhan, Zhongqun Tian. Advances in Pretreatments for Electroless Copper Plating on Polymer Materials[J]. Acta Chimica Sinica, 2022, 80(5): 659-667.

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Fig. & Tab. 7

Figure 1. Chemical reactions involved in silver coating formation on ABS surfaces

Figure 2. Experimental steps of electroless copper plating on carbon fiber surface

Figure 3. Schematic illustration of adsorption promotion of Ag nanoparticles by cationic surfactants

Figure 4. Schematic diagram of electroless copper plating process with argon plasma pretreatment, UV-induced graft copolymerization and quaternization

Figure 5. Schematic of the surface modification on PPS film using photoinitiated ClO2·as an oxidant

Figure 6. Schematic diagram of electroless plating on PVC surface functionalized with semi-IPN hydrogel

Figure 7. Schematic diagram of the mechanism of grafting of polyaminophenyl layer on the surface of KMPR photoresist polymer

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聚合物材料表面化学镀铜的前处理研究进展

Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

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