Acta Chimica Sinica ›› 2022, Vol. 80 ›› Issue (12): 1643-1663.DOI: 10.6023/A22080347 Previous Articles Next Articles
Review
叶淳懿, 邬学贤, 张志彬, 丁萍, 骆静利, 符显珠*()
投稿日期:
2022-08-06
发布日期:
2022-09-16
通讯作者:
符显珠
作者简介:
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叶淳懿, 深圳大学材料学院材料与化工专业在读硕士研究生, 研究方向为面向电子与能源领域应用的化学镀技术及其活化剂. |
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符显珠, 深圳大学材料学院教授, 博士生导师, 从事电化学能源材料与器件及电子材料与制程研究. 2007年厦门大学化学系博士毕业, 2008~2012年在加拿大阿尔伯塔大学做博士后并到美国伯克利国家实验室进行访问研究, 曾于中国科学院深圳先进技术研究院工作. 近5年以通讯作者在Nature Catalysis、Journal of the American Chemical Society、Angewandte Chemie、Energy & Environmental Science、Science Bulletin(科学通报)等期刊发表SCI论文100多篇. |
基金资助:
Chunyi Ye, Xuexian Wu, Zhibin Zhang, Ping Ding, Jing-Li Luo, Xian-Zhu Fu()
Received:
2022-08-06
Published:
2022-09-16
Contact:
Xian-Zhu Fu
Supported by:
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Chunyi Ye, Xuexian Wu, Zhibin Zhang, Ping Ding, Jing-Li Luo, Xian-Zhu Fu. Research Progress of Electroless Plating Technology in Chip Manufacturing[J]. Acta Chimica Sinica, 2022, 80(12): 1643-1663.
ELD metal | Reaction | Application in chip manufacturing |
---|---|---|
Cu | Cu2++2HCHO+4OH‒→ Cu0+2HCOO‒+2H2O+H2 | Seed layer, gap filling, bump |
Ni | Ni2++2H2O+2H2PO2‒→Ni0+4H++2HPO32‒+H2 | Barrier layer, activator layer, UBM |
Au | Au(SO3)23‒+e‒+H2O→SO32‒+SO2+Au+2OH‒ | Bump, UBM |
Co | Co2++2H2O+2H2PO2‒→Co0+4H++2HPO32‒+H2 | Barrier layer, gap filling |
Pd | Pd2++2H2O+2H2PO2‒→Pd0+4H++2HPO32‒+H2 | UBM |
ELD metal | Reaction | Application in chip manufacturing |
---|---|---|
Cu | Cu2++2HCHO+4OH‒→ Cu0+2HCOO‒+2H2O+H2 | Seed layer, gap filling, bump |
Ni | Ni2++2H2O+2H2PO2‒→Ni0+4H++2HPO32‒+H2 | Barrier layer, activator layer, UBM |
Au | Au(SO3)23‒+e‒+H2O→SO32‒+SO2+Au+2OH‒ | Bump, UBM |
Co | Co2++2H2O+2H2PO2‒→Co0+4H++2HPO32‒+H2 | Barrier layer, gap filling |
Pd | Pd2++2H2O+2H2PO2‒→Pd0+4H++2HPO32‒+H2 | UBM |
Molecular name | Abbreviations | Head group | References |
---|---|---|---|
3-Aminopropyltriethoxysilane | APTES/Am1 | —NH2 | [ |
Aminopropyltrimethoxysilane | APTMS/APS | —NH2 | [ |
n-(2-Aminoethyl)-3-aminopropyl-trimethoxysilane | AEAPTMS/Am2 | —NH2 | [ |
2-(Trimethoxysilyl)-ethylpyridine | Py | —C5H4N | [ |
N-(3-Trimethoxysilylpropyl) diethylenetriamine | TPDA | —NH2 | [ |
Alkyl(octadecyltrichlorosilane) | OTS | —CH3 | [ |
3-[2-(2-Aminoethylamino)ethylamino]-propyltrimethoxysilane | ETAS | —NH2 | [ |
(3-Mercaptopropyl)trimethoxysilane | MPTMS | —SH | [ |
Molecular name | Abbreviations | Head group | References |
---|---|---|---|
3-Aminopropyltriethoxysilane | APTES/Am1 | —NH2 | [ |
Aminopropyltrimethoxysilane | APTMS/APS | —NH2 | [ |
n-(2-Aminoethyl)-3-aminopropyl-trimethoxysilane | AEAPTMS/Am2 | —NH2 | [ |
2-(Trimethoxysilyl)-ethylpyridine | Py | —C5H4N | [ |
N-(3-Trimethoxysilylpropyl) diethylenetriamine | TPDA | —NH2 | [ |
Alkyl(octadecyltrichlorosilane) | OTS | —CH3 | [ |
3-[2-(2-Aminoethylamino)ethylamino]-propyltrimethoxysilane | ETAS | —NH2 | [ |
(3-Mercaptopropyl)trimethoxysilane | MPTMS | —SH | [ |
Activator | Process | References |
---|---|---|
PdCl2 | Absorb, reduce | [ |
Ni(NO3)2 | Absorb, reduce | [ |
Pd | Absorb | [ |
Au | Absorb | [ |
Pd Layer | ICB | [ |
K2PdCl6 | Sonochemical reduce | [ |
Cu Film | Sputter | [ |
Ru Layer | ALD | [ |
NiB Layer | ELD | [ |
Activator | Process | References |
---|---|---|
PdCl2 | Absorb, reduce | [ |
Ni(NO3)2 | Absorb, reduce | [ |
Pd | Absorb | [ |
Au | Absorb | [ |
Pd Layer | ICB | [ |
K2PdCl6 | Sonochemical reduce | [ |
Cu Film | Sputter | [ |
Ru Layer | ALD | [ |
NiB Layer | ELD | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
NiSO4•6H2O (NH4)2ReO4 | NaH2PO2•H2O | Sodium citrate | 9.0 (adjusted with NaOH) | 90 | [ |
NiSO4 | DMAB | Citric acid monohydrate | 9.0 (adjusted with TMAH) | 70 | [ |
NiSO4•7H2O Na2MoO4•6H2O | NaH2PO2 | C6H5Na3O7•H2O SDS | 9~10 | 85~90 | [ |
Nickel chloride | Sodium hypophosphite Sodium borohydride | Ammonium citrate dibasic Ethylenediamine Sodium dodecyl sulfate Saccharine | 13 (adjusted with NaOH) | 65 | [ |
Nickel sulfate | DMAB | Citric acid SPS | 9.5 | 70 | [ |
NiSO4•6H2O | DMAB | C6H5Na3O7•2H2O | 9 | 65 | [ |
NiSO4•6H2O | NaH2PO2•H2O | C6H5Na3O7•3H2O | 5.5 (adjusted with NH3•H2O) | 80 | [ |
NiSO4•6H2O Na2WO4•2H2O | NaH2PO2•H2O | Na3C6H8O7•2H2O | 7.0~9.0 | 80~95 | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
NiSO4•6H2O (NH4)2ReO4 | NaH2PO2•H2O | Sodium citrate | 9.0 (adjusted with NaOH) | 90 | [ |
NiSO4 | DMAB | Citric acid monohydrate | 9.0 (adjusted with TMAH) | 70 | [ |
NiSO4•7H2O Na2MoO4•6H2O | NaH2PO2 | C6H5Na3O7•H2O SDS | 9~10 | 85~90 | [ |
Nickel chloride | Sodium hypophosphite Sodium borohydride | Ammonium citrate dibasic Ethylenediamine Sodium dodecyl sulfate Saccharine | 13 (adjusted with NaOH) | 65 | [ |
Nickel sulfate | DMAB | Citric acid SPS | 9.5 | 70 | [ |
NiSO4•6H2O | DMAB | C6H5Na3O7•2H2O | 9 | 65 | [ |
NiSO4•6H2O | NaH2PO2•H2O | C6H5Na3O7•3H2O | 5.5 (adjusted with NH3•H2O) | 80 | [ |
NiSO4•6H2O Na2WO4•2H2O | NaH2PO2•H2O | Na3C6H8O7•2H2O | 7.0~9.0 | 80~95 | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
CoSO4•6H2O Na2MoO4•2H2O | NaH2PO2 | Na-citrate RE610 H3BO3 | 8.9~9.0 (adjusted with KOH) | — | [ |
CoSO4•7H2O Na2WO4•2H2O | NaH2PO2•H2O | Na3C6H5O7•2H2O H3BO3 | 9 (adjusted with KOH) | 85 | [ |
CoSO4•7H2O Na2WO4 | DMAB NaH2PO2 | Na3C6H5O7•2H2O RE610 HCl | 9.5~9.7 (adjusted with NaOH) | 20~85 | [ |
CoCl2•6H2O Na2WO4•2H2O | DMAB | H3C6H5O7•H2O | 9.5 (adjusted with TMAH) | 75 | [ |
CoSO4•7H2O Na2WO4•2H2O | NaH2PO2 | 3Na-citrate H3BO3 | 8~12 | 90 | [ |
Cobalt sulfate Tungsten acid | DMAB | Citric acid | 9.5 (adjusted with TMAH) | 70 | [ |
Cobalt sulfate Tungsten acid | DMAB | Citric acid SPS | 9.5 | 60 | [ |
Cobalt sulfate | DMAB | Citric acid | 9.5 | 70 | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
CoSO4•6H2O Na2MoO4•2H2O | NaH2PO2 | Na-citrate RE610 H3BO3 | 8.9~9.0 (adjusted with KOH) | — | [ |
CoSO4•7H2O Na2WO4•2H2O | NaH2PO2•H2O | Na3C6H5O7•2H2O H3BO3 | 9 (adjusted with KOH) | 85 | [ |
CoSO4•7H2O Na2WO4 | DMAB NaH2PO2 | Na3C6H5O7•2H2O RE610 HCl | 9.5~9.7 (adjusted with NaOH) | 20~85 | [ |
CoCl2•6H2O Na2WO4•2H2O | DMAB | H3C6H5O7•H2O | 9.5 (adjusted with TMAH) | 75 | [ |
CoSO4•7H2O Na2WO4•2H2O | NaH2PO2 | 3Na-citrate H3BO3 | 8~12 | 90 | [ |
Cobalt sulfate Tungsten acid | DMAB | Citric acid | 9.5 (adjusted with TMAH) | 70 | [ |
Cobalt sulfate Tungsten acid | DMAB | Citric acid SPS | 9.5 | 60 | [ |
Cobalt sulfate | DMAB | Citric acid | 9.5 | 70 | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
CuSO4•5H2O | Paraformaldehyde | EDTA | — (adjusted with KOH) | 70 | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA Surfactant RE-610 | 12.3~12.7 (adjusted with KOH) | 65~75 | [ |
CuSO4•5H2O | HCHO | KNaC4H4O6•4H2O 2,2'-dipyridyl Na2S2O3•5H2O NiCl2•6H2O | 12~14 (adjusted with NaOH and Na2CO3) | 25 | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA 2,2'-dipyridine PEG | 12.7 (adjusted with TMAH) | 60 or 70 | [ |
CuSO4•5H2O | HCHO | EDTA PEG | 12.6~12.7 (adjusted with NaOH) | 45 | [ |
CuSO4•5H2O MnSO4•H2O | HCHO | C4H4KNaO6•4H2O | 13 (adjusted with NaOH) | — | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA PEG-Thiol | 12.5 | 70 | [ |
Source of metal | Reducing agent | Additives | pH | Temperature/℃ | References |
---|---|---|---|---|---|
CuSO4•5H2O | Paraformaldehyde | EDTA | — (adjusted with KOH) | 70 | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA Surfactant RE-610 | 12.3~12.7 (adjusted with KOH) | 65~75 | [ |
CuSO4•5H2O | HCHO | KNaC4H4O6•4H2O 2,2'-dipyridyl Na2S2O3•5H2O NiCl2•6H2O | 12~14 (adjusted with NaOH and Na2CO3) | 25 | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA 2,2'-dipyridine PEG | 12.7 (adjusted with TMAH) | 60 or 70 | [ |
CuSO4•5H2O | HCHO | EDTA PEG | 12.6~12.7 (adjusted with NaOH) | 45 | [ |
CuSO4•5H2O MnSO4•H2O | HCHO | C4H4KNaO6•4H2O | 13 (adjusted with NaOH) | — | [ |
CuSO4•5H2O | Glyoxylic acid | EDTA PEG-Thiol | 12.5 | 70 | [ |
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