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化学学报
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化学学报 ›› 2007, Vol. 65 ›› Issue (5): 390-394. 上一篇    下一篇

研究论文

分子结构对硫脲类化合物在铜表面自组装能力的影响

王春涛*,1, 陈慎豪2   

  1. (1太原师范学院化学系 太原 030031)
    (2山东大学化学与化工学院 济南 250100)
  • 投稿日期:2006-03-30 修回日期:2006-09-14 发布日期:2007-03-14
  • 通讯作者: 王春涛

Influence of Thiourea Molecular Structure on Its Self-assembled Ability onto Copper Surface

WANG Chun-Tao*,1; CHEN Shen-Hao2   

  1. (1 Department of Chemistry, Taiyuan Normal College, Taiyuan 030031)
    (2 School of Chemistry and Chemical Engineering, Shandong University, Jinan 250100)
  • Received:2006-03-30 Revised:2006-09-14 Published:2007-03-14

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被引次数

47 | 1

利用电化学阻抗谱和极化曲线研究了硫脲、烯丙基硫脲、苯基硫脲在金属铜表面上的自组装膜的质量和缓蚀效率, 并通过量子化学计算进一步研究了各种分子和金属铜的相互作用. 结果表明硫脲类分子在金属铜表面上的成膜能力顺序为: 苯基硫脲＞烯丙基硫脲＞硫脲, 并揭示了分子结构对硫脲类化合物在金属铜表面自组装影响的本质, 为进一步寻找和制备优良的缓蚀功能自组装膜提供理论依据.

关键词: 硫脲, 自组装, 缓蚀

The quality and inhibition efficiency of thiourea (TU), allylthiourea (AT) and phenylthiourea (PT) self-assembled films were studied by electrochemical impedance spectroscopy and polarization curves, respectively. Quantum chemical calculations were performed to investigate interactions between copper and thioureas. The self-assembled ability order of thioureas onto copper was obtained, which is PT＞A＞TU. The structural essential of thioureas self-assembled on copper was revealed, which can provide a theoretical basis for looking for and preparing more inhibitive self-assembled films.

Key words: thiourea, self-assembly, inhibition