聚合物材料表面化学镀铜的前处理研究进展

doi:10.6023/A22010026

化学学报 ›› 2022, Vol. 80 ›› Issue (5): 659-667.DOI: 10.6023/A22010026 上一篇下一篇

综述

聚合物材料表面化学镀铜的前处理研究进展

郑安妮^a^,^b, 金磊^a^,^b, 杨家强^a^,^b, 李威青^a^,^b, 王赵云^a^,^b, 杨防祖^a^,^b^,^*(), 詹东平^a^,^b^,^*(), 田中群^a^,^b

a 厦门大学化学化工学院厦门 361005
b 厦门大学固体表面物理化学国家重点实验室厦门 361005

投稿日期:2022-01-14 发布日期:2022-05-31
通讯作者: 杨防祖, 詹东平

作者简介:

郑安妮, 厦门大学化学化工学院物理化学专业在读硕士研究生, 研究方向为非导电聚合物材料表面化学镀铜金属化.

杨防祖, 厦门大学化学化工学院教授, 福建省电镀及表面处理行业技术开发基地主任, 福建省表面工程行业协会副会长, 中国表面工程协会电镀分会理事, 《电镀与精饰》和《电镀与涂饰》期刊编委. 长期精深研究高端电子制造电子电镀、金属及合金的电沉积以及化学沉积和表面处理, 具有丰富扎实积累.

詹东平, 厦门大学化学化工学院教授, 博士生导师, 教育部新世纪优秀人才, 福建省杰出青年基金获得者, 《中国科学: 化学》、《Science China Chemistry》、《电化学》期刊编委. 从事高时空分辨电化学仪器、电化学微纳制造装备及高端电子制造电子电镀研究工作.

基金资助:
国家自然科学基金(22132003); 国家自然科学基金(21972118); 国家自然科学基金(21827802)

Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

Anni Zheng^a^,^b, Lei Jin^a^,^b, Jiaqiang Yang^a^,^b, Weiqing Li^a^,^b, Zhaoyun Wang^a^,^b, Fangzu Yang^a^,^b(), Dongping Zhan^a^,^b(), Zhongqun Tian^a^,^b

a College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China
b State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, China

Received:2022-01-14 Published:2022-05-31
Contact: Fangzu Yang, Dongping Zhan
Supported by:
National Natural Science Foundation of China(22132003); National Natural Science Foundation of China(21972118); National Natural Science Foundation of China(21827802)

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摘要/Abstract

聚合物材料表面金属化在通讯、电子、航空航天领域具有重要应用. 化学镀铜是聚合物材料表面金属化的主要技术之一. 聚合物材料表面的前处理直接影响化学镀铜层的结合力及镀层平整度. 本综述详细介绍非导电聚合物材料的种类、组成以及性能, 并概述其表面化学镀铜前处理的研究进展.

关键词: 非导电聚合物, 表面, 化学镀铜, 前处理, 结合力

Metallized polymer materials have been widely applied in the fields of communications, electronics and aerospace. Electroless copper plating is one of the important techniques for surface metallization of polymer materials. The pretreatments of polymer surface can directly affect the adhesion and levelness of the electroless copper coating. In this paper, we introduce in detail the kinds, compositions and properties of non-conductive polymer materials, and review the research progresses of the pretreatments for electroless copper plating on the non-conductive polymer materials’ surfaces.

Key words: non-conductive polymer material, surface, electroless copper plating, pretreatment, adhesion

引用此文

郑安妮, 金磊, 杨家强, 李威青, 王赵云, 杨防祖, 詹东平, 田中群. 聚合物材料表面化学镀铜的前处理研究进展[J]. 化学学报, 2022, 80(5): 659-667.

Anni Zheng, Lei Jin, Jiaqiang Yang, Weiqing Li, Zhaoyun Wang, Fangzu Yang, Dongping Zhan, Zhongqun Tian. Advances in Pretreatments for Electroless Copper Plating on Polymer Materials[J]. Acta Chimica Sinica, 2022, 80(5): 659-667.

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图/表 7

图1. 在ABS表面形成银涂层的化学反应过程图

Figure 1. Chemical reactions involved in silver coating formation on ABS surfaces

图2. 碳纤维表面化学镀铜的实验步骤

Figure 2. Experimental steps of electroless copper plating on carbon fiber surface

图3. 阳离子表面活性剂对银纳米粒子的吸附促进原理图

Figure 3. Schematic illustration of adsorption promotion of Ag nanoparticles by cationic surfactants

图4. 氩气等离子体处理、紫外光诱导共聚接枝和季铵功能化处理的化学镀铜过程示意图

Figure 4. Schematic diagram of electroless copper plating process with argon plasma pretreatment, UV-induced graft copolymerization and quaternization

图5. 光引发二氧化氯作为氧化剂对PPS膜进行表面改性的原理图

Figure 5. Schematic of the surface modification on PPS film using photoinitiated ClO2·as an oxidant

图6. 半互穿网络水凝胶功能化PVC表面化学镀示意图

Figure 6. Schematic diagram of electroless plating on PVC surface functionalized with semi-IPN hydrogel

图7. 聚氨基苯基层在KMPR光刻胶表面接枝的机理示意图

Figure 7. Schematic diagram of the mechanism of grafting of polyaminophenyl layer on the surface of KMPR photoresist polymer

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聚合物材料表面化学镀铜的前处理研究进展

Advances in Pretreatments for Electroless Copper Plating on Polymer Materials

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