Acta Chimica Sinica ›› 2007, Vol. 65 ›› Issue (10): 881-886. Previous Articles     Next Articles

Original Articles

PEG-Cl添加剂存在下的铜电结晶过程研究

辜敏*,1, 李强1, 鲜晓红2, 卿胜兰1, 刘克万1   

  1. (1西南资源开发与环境灾害控制工程教育部重点实验室 重庆 400044)
    (2重庆大学化学化工学院 重庆 400044)
  • 投稿日期:2006-10-09 修回日期:2006-12-31 发布日期:2007-05-28
  • 通讯作者: 辜敏

Electrocrystallization of Copper in the Presence of PEG-Cl Additive

GU Min*,1; LI Qiang1; XIAN Xiao-Hong2; QING Sheng-Lan1; LIU Ke-Wan1   

  1. (1 Key Lab for the Exploitation of Southwestern Resources and the Environmental Disaster Control Engineering of Education Ministry, Chongqing 400044)
    (2 College of Chemistry and Chemical Engineering, Chongqing University, Chongqing 400044)
  • Received:2006-10-09 Revised:2006-12-31 Published:2007-05-28
  • Contact: GU Min

Linear sweep voltammetry, cyclic voltammetry and chronoamperometry techniques were employed to study the copper electrocrystallization process on a glass carbon electrode (GCE) from acid cupric sulfate electrolytes in the presence of polyethylene glycol and Cl ions. The instantaneous nucleation followed by three-dimensional growth was found for the electrocrystallization from the electrolytes with PEG-Cl. The electrochemical active sites on the GCE surface decrease in the presence of PEG-Cl in electrolytes, which inhibited the electrodeposition and electrocrystallization of copper sharply. However, Cl ions had a strong accelerant effect. With the increase of Cl ion concentration, the diffusion coefficient of Cu2+, and the rate of copper electrodeposition and nucleation were promoted. An optimum chloride ion and PEG concentration increased the nuclear density on the GCE surface, which was beneficial to electrodeposits.

Key words: Cu, PEG-Cl, electrodeposition, electrocrystallization, GCE